Used DISCO DGP 8761 #9400887 for sale

DISCO DGP 8761 is a high-end precision Wafer Grinding, Lapping, and Polishing Equipment designed to achieve superior surface finishes and ultra-flat wafers in one compact system. It is capable of performing up to 8 parallel operations on 2-inch to 8-inch diameter wafers at up to 5 mils per minute. The unit is designed for high throughput production of automotive and device components, including semiconductor substrates, MEMS, optical components, and 3D printed parts. DISCO DGP8761 consists of the DGP-810 Grinder to begin wafer grinding, the DGP-720 Lapper for high-precision lapping of the wafers, and the DGP-730 Polisher for finishing and polishing. Each component of the machine is built with the latest technology, using high-quality components, to provide superior results. To ensure quality and accuracy, all components are quality tested before shipment. The DGP-810 Grinder utilizes a high-speed spindle and ultra-precise diamond grinding wheel to quickly grind flat surfaces on the wafer. Its proprietary diamond grinding wheel can be programmed to grind to the exact size and specifications of the desired surface. With its high-precision design, the DGP-810 can attain accuracy at a tolerance rate of ±3 microns. The DGP-720 Lapper grinds the wafer surfaces to extremely high precision with its high-speed, color touchscreen control panel. This lapper's diamond grinding media is optimized for extremely low power consumption and ultra-precise results. The DGP-720 can achieve an up to +/- 5 microns flatness precision on the wafer for the highest quality flatness and surface finish. The DGP-730 Polisher is designed to produce the highest quality polish on the wafer. With its highly accurate polishing roller and advanced polishing media, the DGP-730 is capable of achieving ultra-flat and ultra-smooth surfaces up to ±1 micron flatness precision. The polishing roller is also programmable and can be easily adjusted to accommodate different shape wafers. In summary, DGP 8761 is an advanced wafer grinding, lapping, and polishing tool that is capable of superior results due to its state-of-the-art components and design. Its precision grinding wheels and lapping media can produce surfaces with accuracies at a tolerance rate of ±3 microns. In addition, the programmable polishing roller allows the asset to handle different shaped and sized wafers with ease. As a result, this model is an ideal choice for achieving superior surface finishes and ultra-flat wafers.