Used DISCO DGP 8761HC #9209456 for sale

DISCO DGP 8761HC is an advanced wafer grinding, lapping and polishing equipment designed for the fabrication of microelectronic components at the highest possible level of accuracy and repeatability. The use of a modern design, high end components and dedicated wafer grinding and polishing technologies makes DISCO DGP8761HC a flexible, high performance system that is able to process a wide variety of materials with exceptional uniformity and speed. DGP 8761 HC is equipped with an 8" dia. rotary flat plate on which the wafers are loaded. A special eight zone vacuum chuck ensures high accuracy positioning of the wafer during operation, and automatically compensates for spinout, vibration and other positional errors. This support unit also enables multiple wafers to be ground simultaneously on the same plate. For grinding, DISCO DGP 8761 HC is equipped with a high-speed spindle motor that is capable of reaching speeds up to 7,500 RPM. A special "servo-drive" machine is used to accurately control the spindle speed and positioning of the grinding wheel, which is vital for precision polishing of the wafer surface. The servo-drive tool also ensures perfect alignment of the grindstone with the wafer axis. The lapping process is handled by an automatically adjustable linear lapping table, which allows for the precise and flexible processing of a wide range of materials. The lapping process is designed to produce thin, smooth, and highly uniform coatings on the wafer surface. DGP8761HC also provides a wide range of polishing capabilities. A multi-head polishing device is used to produce a smooth and flat finish on the wafer's surface. This device is equipped with a variety of custom-made polishing pads, including diamond and aluminum oxide pads, ceramic pads, and special rubber buffing pads. These pads are designed to produce a uniform and consistent finish on the wafer. DGP 8761HC also features an intelligent process control asset that is able to recognise and adjust process parameters depending on the material being processed. This model ensures maximum accuracy and repeatability in the fabrication process. The equipment is also protected from damage caused by overloads, failed parts, and other common issues. In summary, DISCO DGP 8761HC is a modern, high performance wafer grinding, lapping and polishing equipment that is capable of producing precision components at a high level of accuracy and repeatability. Its advanced design, components and process control system enable it to process a wide variety of materials with exceptional uniformity and speed.