Used DISCO DGP 8761HC #9211359 for sale

DISCO DGP 8761HC is a multi-functional grinding, lapping, and polishing equipment designed for the efficient production of high-quality wafers. It features unique and innovative technology for superior accuracy and speed, ensuring the highest quality wafers in the smallest possible time. The wafers are grinded, lapped, and polished to exacting standards and then pass through a series of control gates, ensuring uniformity and quality. The system begins with a semi-automatic grinding process, where wafers of up to 8-inch diameter are loaded onto a 6-axis robotic arm. The wafers are grinded by a diamond abrasive wheel, resulting in a uniformed ground surface with minimal surface irregularities. The unit then moves to a lapping process, where the wafers are loaded into a precision lapping machine. The lapping machine utilises diamond abrasives to lap the wafer surfaces flat and achieve the required surface roughness. The grinding and lapping process is followed by a polishing stage, where the wafers are loaded into an automated polishing machine for an additional pass of polishing. The machine features a 6" diameter rotary magnetic table, adjustable axial pressure control, and 3D scanning capabilities, allowing for the accuratepolishment of the wafer surfaces. The final step is a thorough inspection of the wafers, where both visual and mechanical inspections are performed to check for any surface defects. Overall, DISCO DGP8761HC offers state-of-the-art technology for faster and more accurate production of wafers. From grinding and lapping to polishing and inspection - the machine is designed to deliver superior and uniformed wafer surfaces in the shortest amount of time possible. With the combined processes of grinding, polishing, and inspection, the tool helps to save time and increase output while maintaining a high standard of production and wafer quality.