Used DISCO DGP 8762 #9410785 for sale

DISCO DGP 8762 is a wafer grinding, lapping and polishing equipment designed to produce semiconductor wafers to the highest possible quality and consistency. The system utilizes an automated grinding and polishing process, with a compact and streamlined design for efficiency and reliability. It features an automatic grinding head that is capable of grinding and polishing up to twelve wafers at a time, with an automated control unit to ensure consistent results from each polishing cycle. The machine utilizes premium diamond abrasives to deliver a uniform finish, with variable speed control for customizing the results to the specific application. The precision machine has a built-in polishing spindle, which can be adjusted to three different speed settings to facilitate fine polishing of the wafers. The tool is capable of lapping single and double-sided wafers, as well as both flat and curved substrate surfaces. It also has the ability to service substrates made of different materials, such as Si, Sapphire, Ceramics and Quartz. It is designed to optimize the fabrication process by eliminating the need for manual grinding and lapping operations. DGP 8762 is a highly accurate and efficient wafer grinding, lapping and polishing asset. It is powered by a robust motor and equipped with a reliable vacuum chuck that holds the wafers securely during the process. It also has an integrated dust extraction model to ensure that particles generated during the process do not enter the workplace. The equipment features an intuitive and user-friendly interface, which makes it easy to operate even for novice users. Overall, DISCO DGP 8762 is a highly advanced and accurate wafer grinding, lapping and polishing system that is designed to perform reliably and consistently. It is both cost-effective and efficient, with several highly customizable options ideal for meeting the needs of the most sophisticated applications.