Used DISCO DGP 9761 #9257161 for sale

DISCO DGP 9761 is a single sided dry grinding, lapping and polishing equipment designed for high precision processing of wafers and other substrates. This system is capable of grinding, lapping and polishing a wide variety of substrates including glass, quartz, ceramics, ferrites, sapphire, composite materials and more. This multi-purpose unit is able to perform a range of operations including wafer thinning, mirror polishing, back-side lapping, and other precision machining processes. The machine can handle wafers ranging from 2" to 12" in diameter and up to 8 mm in thickness. The fully automated tool allows users to customize various parameters such as circumferential speed, normal load, rotation speed and grinding pressure in order to achieve precise results. The grinding, lapping and polishing asset features the latest CNC control technology, which is designed to achieve chip-free results. The machine is equipped with adjustable gap control and stroke length, which enable superb grinding, lapping and polishing at high-precision level. The model is capable of producing surface roughness down to 0.4Ra micro-inches or better, and features a 0.0001 psi repeatability (+/- 0.001). DGP 9761 grinding, lapping and polishing equipment is designed for use with an enormous range of abrasive and finishing media, including diamond slurries, agates, diamond brush silicon carbide, cerium oxide and others. This system operates at a low temperature and generates minimal dust particles, making it environmentally friendly and easy to maintain. This unit is designed for use in industries such as electronics, telecoms, solar, sensors, automotive and aerospace, where high precision machining is required. The machine can be used in a variety of applications, and its intuitive user interface allows operators to increase productivity and reduce scrap rates. DISCO DGP 9761 is an ideal tool for producing wafers and substrates with the highest quality and precision.