Used DISCO DTG 8440 #293828625 for sale

DISCO DTG 8440 is a robust and easy to use grinding, lapping and polishing equipment specifically designed for manufacturers of high-density cantilever and double-sided wafers. This system is capable of producing sub-aperture dimensions with high accuracy at high throughput. DISCO DTG8440 is suitable for processing multiple wafers in a single set-up, allowing for efficient production of the required number of wafers. DTG 8440 comes with an integrated grinding, lapping and polishing subsystem that allows for precise grinding, lapping and polishing operations. The integrated subsystem is fueled by two servo-controlled grinding spindles, one lapping as well as a polishing spindle. This flexible arrangement of spindles allows for handling of both large and small wafer formats, as well as a full range of grinding and polishing operations. DTG8440 is further equipped with the latest Non-contact Measurement Unit (NCMS) which provides the operator with a precise digital image of the wafer that helps determine the ultimate accuracy of the process. This machine provides accurate information on the characteristics of the wafer's surface and helps in optimizing operational parameters to achieve the desired surface finish. To further ensure desired finish, DISCO DTG 8440 is provided with a wet grinding option that ensures accurate grinding of the wafer. The wet-process enables coolant to be circulated over the wafer surface during the grinding process, which helps reduce thermal effects and increase the removal rate. DISCO DTG8440 is designed for easy operation, maintenance and cleaning. The operator panel is user-friendly and provides real-time process monitoring, precise temperature control and other related controls. In addition, it also mentions a precise information of the grinding status and operational parameters. DTG 8440 also comes with air-conditioned and heated backside cleaning zones that minimize airborne particles and contamination. All in all, DTG8440 is a robust, precision-based tool that allows for efficient and accurate grinding, lapping and polishing of high-density cantilever and double-sided wafers. With its integrated subsystem, versatility in handling multiple wafers at once, NCMS, wet grinding option and user-friendly operator panel, DISCO DTG 8440 helps achieve the desired surface finish and accuracy.