Used DISCO IF-01-1-4 / 8-B-K01 #9142771 for sale

The Equipment 'DISCO IF-01-1-4 / 8-B-K01' Wafer Grinding, Lapping & Polishing System is specifically designed to deliver high quality and cost-effective selective grinding, lapping and polishing on various semiconductor and display panel production lines. It is a multi-functional workhorse providing a versatile solution with numerous lithography application capabilities for various industries. The unit is completely automated with dual robot arm technology allowing for both automated loading and unloading of wafers. A suspended wet grinding station is available and a 5-axis robotic arm with vision feedback oscillation ensures precise grinding. The Lapping Station offers adjustable pressure control and a twin polishing heads which can be adjusted for polishing various wafer sizes and substrate thicknesses. It also features 4-axis positioning accuracy for increased process control and defect free polishing. A wide range of lapping and polishing consumables are available such as diamond powder, diamond plating tools, flat lap, diamond coated lapping pads and more. The machine is also capable of reaching a maximum surface roughness of 0.1 nm Ra and surface planarity of 10 u m across a variety of sample sizes. The tool is directly compatible with various types of semiconductor and display panel production lines and can accommodate round wafers with diameters as small as 5mm. It can also be used in both bonnet-type and spin-type polishing processes to achieve the required surface finish. Its sophisticated software control asset provides real-time logging of each process, which allows for fast and accurate diagnosis of process-related defects or other problems. This wafer grinding, lapping and polishing model is an ideal option for manufacturers who are looking for a reliable and cost-effective solution to increase their production efficiency and improve their product quality. The equipment is compact-sized and flexible enough to be used in a wide range of applications including, but not limited to, semiconductor wafer grinding, lapping and polishing. Its advanced automation features ensure that it is the perfect choice for reducing cost and labor while ensuring the highest quality of production.