Used DISCO RS-01-3-40 / 60-NA-E #9142772 for sale

DISCO RS-01-3-40 / 60-NA-E is an advanced wafer grinding, lapping, and polishing equipment. Designed for precision materials processing and machining, this system is used for processing materials such as silicon, germanium, quartz, and gallium arsenide in the semiconductor industry. The unit is well-suited to machining surface abnormalities such as bumps or notches, and can also be used to create complex structures and patterns on materials such as silicon wafers. This machine includes a variety of components. The grinding and lapping operations are completed by a rotating diamond disc, which can adjust the abrasive force based on the material being processed. It also includes a fine-grain polishing mechanism which allows for highly precise polishing with very little material loss. As a result, it is suitable for both surface grinding and polishing a variety of materials. The tool is operated via an easy-to-use touch panel interface, which enables users to precisely set the parameters depending on the material requirements. The machine also features a unique automatic coolant asset which helps to reduce heat and cool down the grinding wheel and workpiece. Additionally, it includes an optical device which measures and monitors the degree of the processed surface, allowing for better precision in the finished product. Overall, RS-01-3-40 / 60-NA-E is an incredibly powerful wafer grinding, lapping and polishing model. It is highly precise, user-friendly, and offers excellent results when it comes to machining materials such as silicon, germanium, quartz, and gallium arsenide. Whether you need to create intricate structures and patterns on silicon wafers or simply smooth out any bump or notch, this equipment is an excellent solution for your materials processing needs.