Used DISCO RS-03-2-2 / 4P #9142774 for sale

DISCO RS-03-2-2 / 4P is a multifunctional grinding, lapping and polishing equipment utilized in the production of thin silicon and sapphire wafers. This system is designed to perform up to four grinding and polishing operations simultaneously and is capable of producing high quality wafers in a repeatable process. This unit utilizes diamond abrasive discs and a set of solid polishing pads to achieve the desired finish. The grinding and polishing of wafers is an important step in manufacturing wafers for various technologies utilized in semiconductors, optoelectronics, and other industries. The high accuracy and repeatability of the process are key factors in the overall quality of the wafers produced. RS-03-2-2 / 4P consists of a robust grinding and polishing platform along with the necessary accessories and controls. This machine utilizes two linear motor-driven grinding heads, and two variable frequency motor-driven polishing heads, each of which offers programmable speeds and pressures. The heads are operated independently, making it possible to perform complex operations such as interpolating between two different processes. Furthermore, this tool includes a two-stage process chamber, allowing for a precise temperature, pressure, and solution mixture to be applied during processing. The asset also includes safety features such as a rear interlock model to reduce the potential of injury, and an integrated vacuum equipment to remove waste particles from the work table. Additionally, the system includes a powerful control unit which provides users with real-time process monitoring and adjustable parameters. DISCO RS-03-2-2 / 4P is capable of achieving a surface roughness of Ra0.01 μm or less, as well as a surface flatness of 0.001μm, enabling users to produce high quality wafers for a variety of uses. Additionally, the machine features a precision control tool which provides users with precise process control. Together, these features make RS-03-2-2 / 4P a powerful and reliable tool for producing thin-film substrates with perfect flatness and perfection.