Used DISCO (Wafer Grinding, Lapping & Polishing) for sale - page #2

DISCO is a leading manufacturer of wafer grinding, lapping, and polishing equipment known for their high precision and efficiency. The company offers a range of systems, including the DFG 841, DFG 840, and DFG 8540, among others. Wafer grinding units from DISCO use a unique process called "DFG" (Dry Grinder + Fully Automatic Grinder). This system provides exceptional control over grinding parameters, resulting in uniform removal of material from the wafer surface. The DFG 841 is one such system that enables high-speed grinding with minimal heat generation, reducing the risk of damage to delicate wafers. It offers improved accuracy, productivity, and cost efficiency. Lapping machines from DISCO, such as the DFG 840, employ a mechanical polishing method to achieve superior flatness and surface quality. These tools utilize fixed abrasive slurries to remove material, resulting in a high-precision and low-damage process. The DFG 840 is designed for small-diameter wafers and ensures high-quality surface finishes. Polishing assets, like the DFG 8540, use a chemical-mechanical polishing (CMP) process to achieve sub-nanometer-level planarity and surface quality. These models employ a combination of chemical reactions and mechanical abrasion to remove material, providing excellent uniformity and surface smoothness. DISCO's wafer grinding, lapping, and polishing equipment set industry standards for precision and efficiency. Their analogues offer unique advantages, including high-speed grinding, superior surface quality, and sub-nanometer-level planarity. Examples such as the DFG 841, DFG 840, and DFG 8540 showcase DISCO's commitment to providing cutting-edge solutions for semiconductor and electronic component manufacturing.