Used DNS / DAINIPPON AS-2000 #293733191 for sale
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ID: 293733191
Wafer Size: 8"
Vintage: 1998
CMP System, 8"
Dual brush and top side brush chambers
Spin dry
Gases: DHF, NH4OH
(2) Chemical cabinets
MX-7500 TBC Brush load cell amp
PRETECH Fine jet Generator
AC Transformer
FA-21000A PC
YASKAWA SGD Drive
HF Circulation filter
UT3-F3AE-B touch panel
HFC-VWE Hitachi inverter
RORZE Curt-2032-0
Slurry flow controller interface
Power box
IFC-7300-001 Distribution box
Operating system: Windows NT
1998 vintage.
DNS / DAINIPPON AS-2000 is a fully automated wafer grinding, lapping, and polishing equipment, designed to accurately grind, lap, and finish silicon and other compound semiconductor wafers. The system is the most versatile and advanced automation and process control unit available. It is capable of producing a superior wafer surface finish, with superior wafer flatness and thickness. DNS AS2000 provides ideal plane and angular grinding of symetrical and asymmetrical patterned wafers, including step, via and bump grinding. Polishing is accomplished through a freely moving abrasive subject machine, enabling fast and accurate flatness, uniformity and thickness adjustment. The tool also offers a variety of polishing and grinding parameters, including the choice of using different diamond particles for various processes. The asset is equipped with advanced process control and safety systems, such as pressure regulators, vacuum systems, and temperature control units. This ensures accurate and repeatable processes with superior wafer surface condition and quality. Other features include a wafer feeder and a wafer frame which makes it easy to adjust the wafer size, a PLC controller with a touch panel, which offers easy process selection, and a built-in, multiple grinding and polishing modes. For optimal grinding productivity and process performance, DAINIPPON AS 2000 is designed with a host of advanced software features that allow a user to precisely control the grinding and polishing parameters, such as dressing parameters, diamond size, and grade, interface pressure, speed profile, oscillation, and material removal rate. The model also supports process automation via integrated database and programmable logic controllers. The equipment utilizes a realistic system for application of the needed grinding or polishing pressure, which is strongly influenced by the condition of the surfaces. The grinding-polishing control unit also includes a fully integrated software package for monitoring, controlling and analyzing the grinding process in order to ensure extremely tight tolerances and continuous wafer data collection. In summary, DNS / DAINIPPON AS 2000 is a highly advanced wafer grinding, lapping, and polishing machine, offering superior wafer surface finish, with superior wafer flatness and thickness. It is capable of precisely and accurately grinding, lapping and polishing the surface of a number of compound semiconductor wafers, and is equipped with advanced process control and safety systems, making it the ideal choice for a variety of cutting-edge wafer processing applications.
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