Used DNS / DAINIPPON AS-2000 #293791064 for sale

Name: DNS / DAINIPPON AS-2000
Brand: DNS / DAINIPPON
SKU: 293791064
Availability: InStock

URL successfully copied!

Wafer Grinding, Lapping & Polishing

Manufacturer

DNS / DAINIPPON

Model

AS-2000

ID: 293791064

Wafer Size: 8"

Vintage: 1999

CMP System, 8" Double side wafer scrubbing: Pad type bush Wafer speed: 0~20 RPM Brush speed: 0~1,000 RPM Chemical pressure: 0~2 kg / cm² Process time: 60 WPH Dry time: <20 Sec Transfer time: <20 Sec / Chamber Interlock Leak sensor Loader: Front loading Wafer wetting bath Wafer wetting nozzle Roll brush clean module (DBC): Mechanical clean method Brush rotation direction : CW, CCW DiW and chemical flow meter SC-1 Applied chemical Chemical supply accuracy: ±5% ml Brush rotation speed accuracy: ± 2% RPM Wafer rotation speed accuracy: ± 2%RPM Brush rotation speed accuracy: ± 2%RPM Wafer rotation speed accuracy: ± 2%RPM Roll brush clean module (TBC): Mechanical Clean Method Wafer speed: 1500 RPM DiW and chemical flow meter DHF Applied chemical Chemical supply accuracy: ±5% ml Brush rotation speed accuracy: ± 2% RPM Wafer rotation speed accuracy: ± 2% RPM No mega sonic nozzle Dry task module (DTC): Wafer speed: 0~3000 RPM DiW Nozzle Wafer rotation speed: 2-Step speed Wafer rotation speed accuracy: ± 2% RPM N2 Temperature: 100°C Unloader: Front side unloading Wafer map scan Power supply: 208 V, 3.0 kVA, Single phase 1999 vintage.

Read More Close

DNS / DAINIPPON AS-2000 is a high-performance wafer grinding, lapping and polishing equipment. It is a fully automated system specifically designed for use in advanced semiconductor applications. The unit utilizes a patented multi-step automated process to accurately achieve production requirements of high quality substrates, with surfaces that are free from scratches and other contaminants. Utilizing an advanced vision machine, the tool runs through two separate processes for each single wafer: grinding and lapping. The first step is the grinding process, which utilizes a newly designed wafer grinder that holds and positions the wafer onto a grinding wheel. This wheel has stationary, high-frequency resins that are optimized to produce superior texture, flatness and surface finish. The grinding wheel is driven by a high-torque, low-speed motor that utilizes torque sensing technology to ensure fine grinding with minimal variation in thickness and uniformity across the wafer. The lapping process is then used to increase the surface quality of the wafer, providing superior flatness and a very uniform surface finish. To accomplish this, the wafer is placed onto a specially designed high-speed table, which horizontally and vertically indices the wafer for lapping. The lapping material is then released onto the table and the indexing mechanism is used to produce a uniform and consistent grinding surface. Built-in safety features limit the wafer's exposure to the lapping material and its ability to overheat. DNS AS2000 asset also offers a polishing-capable mode, which uses a special setup to further reduce damage and scratches to the surface of the wafer. This model also offers an integrated cleaning equipment that provides a higher quality polish while reducing the need for manual cleaning of the wafers. DAINIPPON AS 2000 is an advanced system designed to meet the stringent requirements of advanced semiconductor applications. Its integrated software and hardware offers an adaptable and cost-effective solution for wafer grinding, lapping and polishing, ensuring superior substrate surfaces that are free of contaminants and scratches.