Used DNS / DAINIPPON AS-2000 #9227409 for sale

DNS / DAINIPPON AS-2000 Wafer Grinding, Lapping and Polishing equipment is an automated abrasive machining system designed to provide the highest level of precision in the fabrication of semiconductor and other electronic components. The unit consists of a sophisticated control center, abrasive tool, grinding and polishing bench, and a precision lapping and polishing unit. DNS AS2000 utilizes a high-performance controller that allows for precise control of the grinding and polishing process, as well as an accurate selection of parts size, surface finishes, and target roughness. The controller is equipped with intuitive controls that guide the user through every step of the grinding and polishing process, ensuring a consistent, repeatable result every time. The incorporated abrasive tools are designed to ensure a precise, uniform abrasion on every part processed. The grinding and polishing bench is outfitted with a diamond-coated belt and a polishing cloth that enable the user to achieve precise, controlled surface texture and polish. An adjustable swivel grinding head allows the user to access hard to reach areas of the part. The precision lapping and polishing unit allows the user to adjust the exact parameters of the process, from the angle of tilt of the tool, to the rotation speed and the abrasive material used. The machine is equipped with a water wash chamber that helps to remove all of the debris and particles generated during the grinding and polishing process. DAINIPPON AS 2000 is an effective and efficient tool for the fabrication of precision electronic components. Its accurate controls, sophisticated abrasive tools, and precision lapping and polishing unit make it ideal for achieving high quality results in a short period of time. The ideal surface finish provided by DNS AS 2000 tool ensures that all parts processed meet the highest standards of quality, and therefore contribute to the success of the industrial process.