Used DNS / DAINIPPON AS-2000 #9227410 for sale

DNS / DAINIPPON AS-2000 is a high-precision wafer grinding, lapping and polishing equipment used to achieve exacting sizes and excellent surface finishes. This system is used in numerous industries such as the electronics and semiconductor manufacturing, fiber optics and more. The unit consists of a high-powered motor, a three-axis CNC grinding table, and accessories such as a diamond grinding tool and a water-cooled spindle. The motor has a built-in overload protection feature which helps prevent machine failure due to heavy cutting forces. The CNC grinding table has an adjustable speed and can be precisely configured for various sizes and geometries. The tool is designed for maximum productivity and requires minimal setup time. It is engineered to minimize loading and unloading of the grinding tool and has a durable construction which ensures long-term reliability. The grinding process begins with a two-step wafer lapping process. The first step is an abrasive lapping process using diamond grit abrasives which produces a uniform surface finish on the wafer. The second step involves the mounting of an abrasive wheel on the spindle and grinding down the wafer to a pre-specified size and shape. The grinding tool used for this process can be a soft wheel, hard wheel or hybrid wheel. The result is a smooth, flat surface that is free from surface defects. The next step is a polishing process to give the wafer a mirror-like finish. This is done using a diamond-saturated suspension and a soft wheel. The process involves a series of chemical and mechanical steps to produce a uniformly flat, scratch-free surface. The asset is designed for optimal precision, efficiency and reliability in the areas of wafer grinding, lapping and polishing. Its high-powered motor and superior grinding table provide superior quality surface finish without surface defects. In addition, its durable construction ensures years of reliable performance.