Used DNS / DAINIPPON AS-2000 #9235501 for sale

DNS / DAINIPPON AS-2000
ID: 9235501
Wafer Size: 6"
Vintage: 2003
CMP System, 6" 2003 vintage.
DNS / DAINIPPON AS-2000 is a wafer grinding, lapping, and polishing equipment specifically designed for the manufacture of semiconductor wafers. This system is capable of both grinding and polishing of up to eight wafers at a time, making high-productivity processing possible. It also offers precision surface finishing and high quality patterns. This wafer grinding, lapping, and polishing machine consists of a three-dimensional automated guideway unit with a vacuum chucking mechanism. This machine allows for faster transfer of wafers from the grinding to the polishing process, thus reducing manufacturing time. Additionally, DNS AS2000 has an integrated air bearing design for smooth and accurate wafer transfer. It also has an independent air cooling tool to prevent thermal stress. DAINIPPON AS 2000 are capable of achieving superior surface roughness (Ra) of 7 nm or less and a mirror-like finish on both front and backside of the wafer. This superior accuracy is due to its precise machine subsystems, including kinematics that feature low clearances on all axes, and variable linear speed for improved accuracy. The linear drives used to control spindle and grinding heads for highly accurate and repeatable results. DNS AS 2000 asset comes with a wide range of wafer sized including up to 6 inches and has a capacity of up to 8 wafers. The grinding and polishing process is performed on-plane, which leads to minimal stress and warping, ensuring accuracy and repeatability of the results. AS 2000 model also offers the possibility for manual alteration of the process if required. Furthermore, the equipment can also be connected to third-party metrology systems for monitoring and optimization of the process. In conclusion, DNS / DAINIPPON AS 2000 wafer grinding, lapping, and polishing system offers high-productivity processing, precision surface finishing, superior surface roughness, and low-stress process, as well as the possibility for quick adjustment and third-party integration with metrology systems.
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