Used DNS / DAINIPPON AS-2000 #9361323 for sale

DNS / DAINIPPON AS-2000 Wafer Grinding, Lapping & Polishing Equipment is an automated, highly precise system designed for fabrication of semiconductor wafers. This unit is composed of several components such as a grinding and lapping head, wafer chuck, control unit, and safety cover. The grinding and lapping head is equipped with two rotary discs which are used for grinding and lapping of the wafers. These rotary discs are driven by motors with adjustable speed. This ensures that the wafers are consistently ground and lapped according to the specified surface profile requirements. The wafer chuck lets users mount the wafers securely onto it during grinding and lapping process. The control unit on DNS AS2000 machine provides users with comprehensive control over the grinding, lapping, and polishing process. It includes functions such as surface profile measurement, automatic adjustment of the disc speed, and wafer orientation. It also allows for the adjustment of the rotary speed, pressure, and force according to user specifications. The control panel also features a button for safety cover operation, enabling users to securely close the tool. DAINIPPON AS 2000 Wafer Grinding, Lapping & Polishing Asset is equipped with a safety cover to prevent accidental contact with moving parts. This cover ensures that users stay safe throughout the entire process. In conclusion, DNS AS 2000 Wafer Grinding, Lapping & Polishing Model is an automated, highly precise equipment designed for fabrication of semiconductor wafers. It is equipped with a grinding and lapping head, wafer chuck, control unit, and safety cover. The comprehensive control unit on the system allows for the adjustment of the disc speed, pressure, and force according to user specifications. Finally, the safety cover prevents accidental contact with moving parts.