Used DNS / DAINIPPON / SCREEN AS 2000 #293604832 for sale
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ID: 293604832
Wafer Size: 8"
CMP System, 8"
Missing parts:
Air operation valve
LD Door
DBC Upper brush rotating sensor optical fiber cable
Touch monitor for chem cabinet
DBC Upper brush rotating motor
DBC Spring side chuck cylinder
DBC Driving side chuck cylinder
TBC Lip seal holder
TBC Chuck spring assy
DTC Spin base assy.
DNS / DAINIPPON / SCREEN AS 2000 is an advanced wafer grinding, lapping, and polishing equipment designed to improve the precision, performance, and repeatability of the production process. The system is equipped with two main components—a single side active grinding spindle and a double side simultaneous grinding spindle. The first is used for preparing the wafer surface in preparation for its lapping and polishing process. The second spindle enables both sides of the wafer to be ground simultaneously with incredibly precise results. Additionally, the unit features variable spindle speeds, allowing users to precisely control the grinding speeds and ensure the best results. The speeds can also be adjusted to adapt to different products, workpiece geometries, and applications. The unit additionally features a highly precise and efficient grinding motion, generating a superior finish quality. Additionally, it offers a wide array of grinding accessories, such as special fixtures and polishing plates designed to make the process more efficient and consistent. In addition to the grinding capabilities, the unit features a powerful lapping and polishing machine for producing precision wafer surfaces. It can process wafers with a radius of up to 200mm, as well as up to 15mm in thickness. The tool enables users to easily adjust the lapping and polishing parameters and speed to suit the individual application. For added ease and safety, it also features a comprehensive remote control asset, allowing users to control all aspects of the process from a single, safe location. This control model enables users to access all functions, including the spindle speeds, grinding force and other parameters from a computer or mobile device. The inclusion of advanced safety features such as safety guards and interlocks, coupled with the high-precision process control technology, makes the equipment well suited to demanding environments, while still maintaining an efficient throughput. Overall, DNS AS 2000 is an advanced and powerful wafer grinding, lapping, and polishing solution designed to improve the precision, performance, and repeatability of the production process.
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