Used DNS / DAINIPPON / SCREEN AS 2000 #293740641 for sale
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DNS / DAINIPPON / SCREEN AS 2000 is a leading wafer grinding, lapping, and polishing equipment, designed for semiconductor device fabrication. It is based on a unique and innovative system of grinding and polishing technology, which creates a reliable and repeatable finish that is suitable for production needs. First, the unit allowing grinding down the surface of wafers to generate flat and smooth surfaces. It is an automated very fine abrasive grinding process that utilizes which utilizes diamond or silicon carbide grinding wheels. Its purpose is to generate a perfectly flat and parallel surface on the wafer before it can be polished. It includes a powerful spindle drive motor, a precision workhead, floating polishing head, and active lateral control. The machine has exceptional surface finish characteristics, with a typical results of 0.2 μm. It also offers a wide range of process parameters, such as upper and lower pressure, material removal rate, vibration reduction, etc. The next step is the lapping stage, which is an advanced polishing technique that utilizes abrasive particles to smooth the surface of the wafer. This is done in a liquid medium in order to improve the surface finish and reduce surface defects. The tool is highly automated, with automated water flow and air circulation to precisely control the lapping process and ensure that the wafer is uniformly polished. With a precise mix of controlled abrasives, the lapping stage makes it possible to achieve homogenous surface textures with high degrees of performance and stability. Once the wafer has been ground and lapped, the asset proceeds with the polishing process using fine slurry and a polishing pad. This achieves a homogenous and smooth surface that is necessary for semiconductor devices. The precision of the polishing stage is guaranteed by the model's built-in automated grinding and polishing software, which monitors the process parameters of the operation in order to achieve the highest level of accuracy. The equipment can provide high-quality finishes, with a typical result of 0.1 μm. Overall, DNS AS 2000 is an advanced wafer grinding, lapping, and polishing system. With its reliable and repeatable technology, it is able to achieve high-level surface finishes with precise and accurate control. Its software and automation also make the unit easy to use, reducing the chance of any user-induced inconsistencies. As a result, this makes it a perfect choice for semiconductor device facilities looking for premium results.
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