Used DOALL C-916A #9223467 for sale

ID: 9223467
Vintage: 2001
Horizontal saw Rectangular capacity (90 Degrees): 9" x 16" Round capacity (90 Degrees): 10-3/4" Saw band (Maximum): 1" x 0.035" x 158" Drive motor: 2 HP Band tension: 30,000 PSI Band speed (Variable): 105 - 275 FPM Band wheels: 14-1/2" Index length: 3/16" - 24" Index repeatability: +/-0.015" Coolant system: (5) Gals in bucket Auto feed: 8-10" 2001 vintage.
DOALL C-916A is a highly advanced, state-of-the-art wafer grinding, lapping and polishing equipment designed specifically for the production of high precision wafers for the microelectronics industry. The system is composed of four primary components: a grinding station (including a diamond disk), a lapping station, a polishing station and a metrology station. The grinding station, which uses diamond wheels, allows for high-precision wafer grinding. The lapping station is capable of producing very uniform wafers with low defect rates, thanks to the use of lapping abrasives. The polishing station uses a tumbling action and special polishing abrasives to achieve a very high surface finish. Finally, the metrology station uses interferometry to measure surface flatness and surface roughness of each wafer. C-916A is highly versatile and adaptable to a wide range of materials and wafer sizes. It is also capable of producing both single-sided and double-sided wafers. The unit is also highly automated, allowing it to work unmanned for long periods of time. This automation helps to maximize the efficiency and throughput of the machine, resulting in higher yields and reduced manufacturing costs. DOALL C-916A is also equipped with a number of safety features, including a safety interlock tool, sensitive touch buttons and an emergency stop button. These safety features ensure the asset is safe to operate. In addition to the safety features, C-916A also offers a number of innovative features, such as a leaching-resistant vacuum chuck for automatically loading and unloading wafers, an intuitive graphical user interface, an integrated recipe management model and a high-precision linear motor for precise and repeatable grinding, lapping and polishing operations. In conclusion, DOALL C-916A is an advanced, highly capable wafer grinding, lapping and polishing equipment that is capable of producing high-precision wafers with very low defect rates. It offers a number of safety and maintenance features, as well as a number of innovative features designed to maximize efficiency, productivity and cost savings.
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