Used DOMAILLE ENGINEERING HDC-5000 #293616762 for sale

DOMAILLE ENGINEERING HDC-5000 is a next-generation Wafer Grinding, Lapping & Polishing equipment for multiple functional substrate processing. As the name suggests, HDC stands for High Density Chemical Polishing System. HDC-5000 is a hybrid grinding, lapping and polishing unit that accurately grinds or lapps substrate surfaces on both the face and the edge side for extreme surface finishes. This hybrid machine uses an integrated chemical-mechanical action to produce an ultra-fine surface finish - typically 1 to 3 Angstrom-range. DOMAILLE ENGINEERING HDC-5000 offers high throughput, precise control and low particle contamination. It uses the latest tools and technologies to achieve a uniform thickness, positional accuracy and surface uniformity all within the same tool. It is designed to quickly, cost-effectively and accurately process all types of substrates, including ordinary and special-purpose materials such as CMP, photoresist removal, diamond blade lapping and polishing, and other special and hard to process applications. HDC-5000 uses a single-table asset with a precision-machined lower grinding platen and upper lapping platen. The lower platen is used for grinding the semi-facing surfaces with a rotary dry diamond grinding wheel, while the upper platen is used for lapping or polishing the surfaces with a flat or robotically-controlled polish pad. DOMAILLE ENGINEERING HDC-5000 can be used for both ultra-precision grinding and lapping or polishing of standard materials, such as silicon wafers, glass, super-hard materials and other fragile materials. It offers precise control and manipulation of the substrate surface for a perfect finish as well as improved process yield. HDC-5000 can be tailored to specific requirements for extreme surface finish and defect control. Its impressive features and advanced model design make DOMAILLE ENGINEERING HDC-5000 the ideal solution for any SMT, assembly and production line.