Used DOOSAN UNIPLA 211 #9308180 for sale

DOOSAN UNIPLA 211 is a wafer grinding, lapping & polishing equipment developed to provide a cost-effective, highly efficient alternative for those needing automated polishing solutions. It is ideal for use in microelectronic and optoelectronic device manufacturing as well as in product assembly and metrology applications. The system is based on a proven design featuring a high-torque direct drive spindle assembly, two load/unload stations, and an adjustable spindle travel range. This allows for the flexibility to efficiently run up to four wafers simultaneously. Additionally, UNIPLA 211 is powered by a reliable brushless DC motor that is capable of operating at up to 400,000 rpm with adjustable speed from 0 to full speed. The unit is designed to maximize productivity with optimized wafer processing times. It employs a unique grinding, feeding, polishing and cleaning process that is perfectly tailored to the substrates used in today's microelectronic and optoelectronic device manufacturing. The polishing process offers superior performance with minimal material consumption and improved surface uniformity. The polishing results in a smooth finished surface that is ideal for dielectric isolation, electronic integration, and other precision applications. Perhaps the most unique feature of DOOSAN UNIPLA 211 is its automated grinding, lapping, and polishing capabilities. The machine adds functionality with its multi-level grinding and lapping feature, which allows it to remove different types of machining and polishing defects. This helps to speed up production and reduce the possibility of errors. Additionally, it includes easier cleaning and maintenance available with a parencyc-assisted grit collecting tool that ensures efficient cleanup of all machining residues. UNIPLA 211 is user-friendly and easy to operate. This user-friendly design allows for fast production since it requires minimal setup time and minimal staff involvement. Its user-friendly software provides detailed operating information as well as full automation diagnostics for better reliability and performance. Furthermore, the user-friendly design of DOOSAN UNIPLA 211 also makes maintenance and troubleshooting quick and easy, resulting in less downtime and improved productivity. Additionally, the asset includes intuitive user interfaces that can be individually tailored to meet specific requirements. Overall, UNIPLA 211 is an excellent choice for those needing an efficient and cost-effective wafer grinding, lapping, and polishing solution. It offers numerous features that help reduce manual labor, maximize productivity, and improve precision. This, combined with its user-friendly design, make it an ideal solution for those in need of a high-performance automated polishing model.