Used DOWELL HR-300 #9247197 for sale

DOWELL HR-300 is a state-of-the-art wafer grinding, lapping, and polishing equipment developed in partnership with the world's leading precision abrasives and chemical suppliers. This system is designed to provide a highly productive and cost-effective solution for all high precision finishing processes for all sizes and shapes of semiconductor wafers and related substrates. HR-300 is capable of performing very fine finish processes, such as precision grinding, lapping and polishing of the surface of a wafer or semiconductor device. The grinding process is typically accomplished by utilizing diamond or other abrasive materials to ensure uniform media size, shape, and surface flatness in the finished product. The lapping process is used to precision-hone the flatness and surface finish of the wafer. This process is usually done by using high-precision lapping plates that can be repeatedly flattened and resurfaced. Lastly, the outer surface of the wafer can be polished to achieve a smooth surface finish. DOWELL HR-300 uses a computer-controlled robotic arm to move the wafer in-and-out of each of the process stages. This all-in-one robotic unit with its 8-motor drive provides precise control for transferring the wafer between the grinding, lapping and polishing stages. The machine also provides automated process surveillance and feedback systems to provide in-process monitoring and control. This allows users to easily adjust the processing parameters for each stage of the process. HR-300 features a modular design which enables the user to customize the tool according to their specific needs. The modular units enable the user to add additional processing stages, configure the robot arm for a wide range of wafer specifications, and upgrade the asset with the latest in cutting-edge technologies. DOWELL HR-300 also includes the latest in safety features, such as an emergency stop model and a 'Wafer Process Alert Equipment' which will stop the process if any unusual process indications or physical contacts are detected. HR-300 system is a highly advanced and reliable tool for those looking for state-of-the-art wafer grinding, lapping and polishing for a wide range of semiconductor substrates and devices. With its powerful computer-controlled robot arm and detailed feedback unit, DOWELL HR-300 takes grinding, lapping, and polishing to the next level of accuracy and precision.