Used DOWELL HR-300 #9247202 for sale

ID: 9247202
Vintage: 2010
Griding system 2010 vintage.
DOWELL HR-300 is an advanced wafer grinding, lapping, and polishing equipment designed for modern semiconductor fabrication needs. This system provides increased versatility and accuracy to simplify processes from wafer-to-wafer processing. It utilizes an Intel® Core i7 processor and CAM software for process control to offer consistent results with high precision. The unit's core components include a powerful robot arm, precision diamond tools, a wet or dry processing chamber, and a precise grinding/lapping fixture. The robot arm is capable of balancing high speed, large motion range, and programmable motion with specialized capabilities that accommodate the wide variety of wafer types available in the market. Additionally, the customizable diamond tools are used to facilitate grinding, lapping, and polishing processes. These tools come in a variety of grades and sizes to accommodate different types of substrates. The wet or dry processing chamber is designed to give users the flexibility to perform a variety of grinding, lapping, and polishing processes. With its ability to provide clean and dust free processing environments, users can create excellent surface finishes and process high-purity materials. The chamber is specially designed for high throughput and reworkable processes, allowing users to adjust material properties and process parameters for highest quality products. The precise grinding/lapping fixture sets HR-300 apart from competitors. This unique design allows two, three, or four-sided grinding/lapping to occur simultaneously for wafers up to 7" (18mm) in size. A die-attach flatness is obtained to within +/- 6µin, and a continuous lapping process can be used with a mechanical stage for enhanced precision and accuracy. Overall, DOWELL HR-300 is an advanced wafer grinding, lapping, and polishing machine suitable for handling delicate substrates. With its intelligent process control, superior precision tools, customizable diamond tools, and ability to handle a variety of substrates, HR-300 is the perfect choice for modern semiconductor fabrication needs.
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