Used EBARA EAC 200bi #9157655 for sale

EBARA EAC 200bi is a precision wafer grinding, lapping and polishing equipment developed by EBARA Corporation to meet the production and maintenance requirements of semiconductor manufacturers. The system is designed to provide superior surface roughness, flatness and accuracy with minimal waste, as well as short cycle times. At the core of EBARA EAC200BI is its patented abrasive unit with two independently adjustable grinding heads. The heads use a two-step grinding process that simultaneously grinds in two directions, allowing for faster creep feed grinding and superior polishing capabilities. The motorized, adjustable grinding wheels are composed of CBN or diamond and deliver high-precision results with greater efficiency. In addition, the machine boasts an integrated lapping platen for efficient sample mounting and polishing and a wafer transport mechanism for hassle-free sample exchange. To ensure quality and consistent performance, EAC 200bi is designed with a number of features, including a multi-layer sturdy frame that prevents vibration-related problems and provides stability during grinding. The tool also offers a high-precision linear guide asset, which provides accuracy of less than 0.5 microns, and a special cooling oil circulation module to prevent tool wear and clogging. EAC200BI's sophisticated software allows up to 200 programs to be stored and easily recalled at any time. Additionally, a series of built-in safety features provide protection and peace of mind, such as an emergency stop switch to quickly shut down the model in an emergency. A Laser Interferometer is also available for measuring wafer position and surface roughness. EBARA EAC 200bi is an efficient, reliable and highly effective equipment for grinding and polishing semiconductor wafers to exacting specifications. The system's superior quality, fast cycle times and range of advanced features make it the perfect choice for all of your grinding, lapping and polishing needs.