Used EBARA EAC300BI-T #9290804 for sale

EBARA EAC300BI-T is a wafer grinding, lapping and polishing equipment designed to create the ultimate in wafer surface finishing. The system is designed to work with various wafer sizes, from 4" to 12", and is suited for use in the semiconductor industry. EBARA EAC 300 BIT is a three-stage device that is capable of producing high-precision wafers. In the first stage, the wafer is placed in the grinder, where a diamond-abrasive wheel is used to grind the wafer to the desired thickness and shape. In the second stage, a high-precision diamond-abrasive lapping film is used to smooth out the rough edges of the wafer. Finally, in the polishing stage, a carbon-abrasive slurry is applied to the wafer surface to achieve a mirror-like finish. The unit also features a built-in, precision-controlled X, Y,theta-axis positioning table, which allows for precise and repeatable wafer polishing processes. The machine also includes auto-loading, auto-teaching, and auto-unloading functions to facilitate wafer processing. Additionally, a real-time control tool allows for precise control of the wafer grinding, lapping, and polishing processes by adjusting the RPM of the grinding wheel and the abrasive slurry parameters. EAC 300BI-T is also equipped with a variety of safety features to help ensure operator safety. The asset features a two-hand safety control, as well as an emergency stop button and an eye wash station. Additionally, the model has an underwater exhaust equipment which helps reduce noise levels, as well as reduce the amount of dust that is generated during wafer processing. In addition to its safety features, EBARA EAC 300BI-T is designed to be easy to use and maintain. The system comes with a detailed user manual, as well as an extra set of diamond grinding wheels, lapping films, and abrasive slurries for longer production runs. The unit also features a low-maintenance design, with minimal upkeep required to keep your machine running at peak performance. EBARA EAC 300 BI-T is an ideal solution for producing high-quality and reliable wafers in the semiconductor industry. With its three-stage grinding, lapping, and polishing tool, precision-controlled positioning table, built-in safety features, and low-maintenance design, EAC 300 BIT is sure to provide reliable and consistent results in a cost-effective and efficient manner.