Used EBARA / EDWARDS Frex 300 #293606134 for sale
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ID: 293606134
Wafer Size: 12"
Vintage: 2001
CMP System, 12"
EFEM (Load/Unload):
(4) ASYST Load ports
YASKAWA Electric robot
Position control: Motor + Ball screw
Dry robot
Wafer transfer:
(2) Turn overs (R/L Side)
(2) Pushers (R/L Side)
(4) LTP Linear stages (R/L Side)
(2) Lifters (R/L Side)
Wafer stage (R/L Side)
Wet robot
Polishers:
(2) Top ring normal heads
(2) Buffing tables
Slurry line
Chemical (CL) connection
Return Line
(2) Dressers (R/L Side):
Diamond pallerc type
Disk type: Plate
(2) Tables (R/L Side):
Material stainless steel
Lapping surface
Motor
Cleaner:
1st Cleaner:
(2) Roll scrubs
(2) Megasonics
Wafer roller: Duro 90
SC-1 < 60°C
2nd Cleaner (Pencil and SRD Unit):
(2) Roll scrubs
Megasonic
Poewr control unit:
Power contol
(4) Drivers:
Head rotation
Head swing
Operation contriller(ETC):
Hardware:
VME Bus, board computer
Main CPU: 68 Series 32 Bit
2001 vintage.
EBARA / EDWARDS Frex 300 is an advanced wafer grinding, lapping, and polishing equipment designed for semiconductor manufacturing processes. This system incorporates cutting-edge technologies to enable precise and efficient processing of wafers used in semiconductor device production. As a crucial step in semiconductor fabrication, wafer grinding, lapping, and polishing play a critical role in achieving the required wafer thickness, flatness, and surface quality essential for high-performance semiconductor devices. At the heart of EBARA Frex 300 unit is its robust and sophisticated design that enables superior control and customization of the wafer processing parameters. The machine features a high-precision grinding mechanism that leverages advanced materials and engineering principles to achieve the desired thickness reduction of the wafers with exceptional accuracy and repeatability. This precision grinding process is essential for achieving uniform wafer thickness across the entire wafer surface, ensuring optimal performance and reliability of the semiconductor devices manufactured using these wafers. In addition to grinding, EDWARDS Frex 300 tool also incorporates lapping and polishing capabilities, further enhancing the surface quality and flatness of the wafers. Lapping is a critical process that helps remove subsurface damage caused during the grinding process, improving the overall quality of the wafer surface. Frex 300 asset utilizes advanced lapping techniques to achieve high levels of flatness and surface smoothness, essential for ensuring the precise alignment and bonding of device layers during semiconductor fabrication. Polishing is another key process integrated into EBARA / EDWARDS Frex 300 model, which helps achieve the final surface finish required for semiconductor wafers. Through a combination of advanced polishing pads, abrasive slurries, and process controls, the equipment can achieve sub-nanometer surface roughness levels, ensuring optimal device performance and yield. The polishing process also helps remove any remaining surface defects and contaminants, further enhancing the quality and reliability of the wafers for semiconductor device manufacturing. EBARA Frex 300 system is equipped with state-of-the-art automation and control features that enable seamless operation and monitoring of the wafer processing parameters. Advanced sensors, feedback mechanisms, and real-time monitoring capabilities ensure precise control over key process variables such as pressure, speed, and temperature, allowing for optimal processing conditions and consistent results. The unit's user-friendly interface and software enable operators to set up custom processing recipes, monitor process progress, and generate detailed reports for process optimization and quality control. Overall, EDWARDS Frex 300 wafer grinding, lapping, and polishing machine represents a cutting-edge solution for semiconductor manufacturers looking to achieve high-quality wafers with exceptional precision and efficiency. By leveraging advanced technologies and engineering principles, the tool offers superior control, customization, and performance for critical wafer processing steps, enabling the production of high-performance semiconductor devices with unparalleled reliability and consistency.
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