Used EBARA EPO-112 #9246168 for sale

EBARA EPO-112 is a programmable, precision, wafer grinding, lapping and polishing equipment specifically designed to prepare wafers for high-quality back side thinning, wet etch results, and other manufacturing processes. At the heart of the system is the CNC controller, which provides complete control of grinding, lapping, and polishing operations with digital readouts for precision repeatability. The unit includes a unique one-piece Ringflex lapping plate, available with three sizes of felt padding, which allows thin, uniform grinding and polishing for a variety of wafer sizes. An optional heat blanket provides precise uniform temperature control, which is critical for ultra-thin wafer thinning operations. Additionally, an arrow machine on the Ringflex plate and wafer holder allows for fine-tuning of grinding and polishing operations. To facilitate process repeatability and adjustability, the tool features programmable process parameters, which includes product dimension, desired polishing time, grinding stroke, grinding pressure, stroke speed, lapping speed, and dynamic distribution of each of these parameters throughout the entire process. Process parameters can be varied for different materials and wafer type and size. The asset also comes with a touchscreen interface that is user friendly and intuitive, allowing easy access to the settings and parameters of each processing step, while having the ability to store up to 20 pre-programmed process settings. A smart protection model also guards against damage to the wafer grinding and polishing tools, including grinding plates, polishing pads, and polishing wheels. To protect the operator of EPO-112 equipment, it features a variety of safety measures. An automatic safety system guards against potential hazards, such as dirty grinding plates and plates with a broken lapping plate. Additionally, a mechanical grinding plate guard prevents the operator from unintentionally coming into contact with the wafer, while also locking the lapping plate in place to ensure repeatable results. The unit is capable of etching and/or grinding parabolas, circular, rectangular, or other shapes, as required. The machine is also capable of cleaning the grinding surface quickly and efficiently. An optional solvent rinse spray can be used to flush away any debris, while a powerful deionized water spray tool enables faster wafer surface cleaning. EBARA EPO-112 asset provides an automated, repeatable, precise, and efficient method for wafer grinding, lapping, and polishing. The model's touch screen interface, programmable parameters, necessary safety features, and available accessories make it an ideal choice for a variety of wafer manufacturing processes.