Used EBARA EPO-113 #293759261 for sale

EBARA EPO-113 is a high-precision wafer grinding, lapping and polishing equipment. It has been designed to meet the most demanding requirements of semiconductor and optical component manufacturers. This system provides state-of-the-art performance, accuracy and users can improve their process and productivity by grinding, lapping and polishing single, double-sided and multi-layer substrates. EBARA EPO 113 employs the latest in motor control and drive technologies. This unit is equipped with high performance brushless motors and is capable of achieving improved linearity, high speed and large torque output. The total grinding speed can reach up to 5,000rpm, eliminating the need for high-cost labour. EPO-113 can also be programmed to achieve different cutting profiles, allowing users to tailor their grinding and polishing processes for different materials. It also features a range of integrated safety features, including a smart sapphire pressure machine, an emergency stop button and an emergency stainless steel plate. The tool can process workpieces up to 6" in diameter, making it suitable for both large and small substrates. EPO 113 adopts a linear drive technology which aids in achieving a smooth cutting process and a high degree of accuracy. EBARA EPO-113 is equipped with an advanced CCD monitoring asset to ensure a precise finish. The powerful grinding and lapping process is very gentle on the workpiece and avoids any damage to the material. This model is also designed to automatically detect the end of the cutting process to prevent inaccuracy and deviation. EBARA EPO 113 equipment is ideal for a wide range of precision grinding and lapping applications, including semiconductor and optical component manufacturing. With its advanced technologies and quick setup time, users can streamline their processes while achieving an improved overall wafer quality.