Used EBARA EPO-113 #293760238 for sale

EBARA EPO-113 is an automated, multi-functional grinding, lapping, and polishing equipment. EBARA EPO 113 is designed to provide high precision and efficiency during production of silicon, germanium, and other semiconductor wafers and other products. The system is equipped with an advanced controller and several lapping tables and consumable and grinding accessories. It also comes with eight planes available to grind, lap, or polish the wafers. The unit comes with adjustable work- and material-holding fixtures, allowing for greater flexibility and improved accuracy and repeatability while maintaining a controlled and standardized process. On each lapping table, multiple sets of grinding media are used to remove material from the wafer tilting the table in all directions to prevent stress concentration on the wafer surface. Variables such as table speed, load force, and grinding media size enable the user to adjust the grinding and finishing parameters to achieve the desired results. The grinding, lapping, and polishing results for each wafer begin with a loading robot; this robot automatically places the wafer on the lapping table and adjusts the media loading position and pressure according to the programmable parameters. Following this, the polishing parameters are executed and the machine continuously monitors the grinding and polishing of the wafer. After polishing is complete, the wafer is unloaded from the grinding lapping table and transferred to the polishing station. At the polishing station, the wafer is inspected for surface finish. EPO-113 also boasts quick and easy programming that can be done on the touch screen panel or with an external PC. This feature ensures that all samples processed on the machine are completed quickly and reliably, reducing the time needed to set or change processes. EPO 113 is designed to minimize dust contamination, which can significantly affect the quality of wafer production. Its highly efficient dust collection tool ensures both a clean working environment and the required air quality. Overall, EBARA EPO-113 is a reliable, well-designed asset with an advanced automated controller and quick and easy programming interface. The adjustable work- and material-holding fixtures, multiple grinding planes, and dust collection model ensure precision and a high-quality finished product. EBARA EPO 113's quick setup and flexible parameters make it an ideal choice for any wafer grinding, lapping, and polishing needs.