Used EBARA EPO-113 #293825809 for sale

EBARA EPO-113 wafer grinding, lapping and polishing equipment offers powerful and precise wafer grinding, lapping and polishing capabilities for a wide variety of applications. It is capable of handling single-sided or double-sided wafers up to 8 inches in diameter at speeds of up to 15,000 rpm, providing exceptional precision and repeatability. The streamlined machine design of EBARA EPO 113 eliminates complexity while ensuring reliability and accuracy. It features a full selection of precision abrasive products, from bonded diamond and abrasive discs to resin and polishing felts. It also has a three-axis Linear Motor system for independent control of the wafer carrier, grinding head and polishing tables with a resolution of 0.01 micron and a repeatability of 0.5 micron. EPO-113 is also exceptionally flexible, offering the ability to switch from grinding to polishing in seconds with a simple exchange of the head and table. The wafer positions for grinding positioning and the polishing table are preset in the controller, ensuring that all parameters remain the same after a switchover. The intuitive user-friendly 12" LCD control panel with color graphic display allows for simple control of the wafer grinding and polishing process. The process parameters, such as speed, pressure and abrasive type, are easily adjustable, while the process can be controlled manually or programmed via a recipe unit. The machine also utilises RFID technology that can automatically detect grain size, type and cut. This further automates the grinding and polishing process and ensures consistent results. Finally, the safety of the operator and those nearby is critical. EPO 113 is designed with a series of safety features including an intuitive active safety interlock machine and LED indicators, a high-pressure vessel isolation feature, and dust collector vents for dust collection and particle disposal.