Used EBARA EPO-113 #293825810 for sale

EBARA EPO-113 is an automated wafer grinding, lapping and polishing equipment designed to provide precise, consistent and repeatable polishing results. This system can process a large variety of wafers up to 6-inch in diameter with high levels of efficiency and accuracy. EBARA EPO 113 is built upon a rigid, vibration-dampening frame and contains an integrated, low-noise vacuum unit. This machine allows the precise, repeatable application and removal of various grinding, lapping and polishing media. The precise motion control and precise motion profiles are driven by three high-precision brushless servomotors on two separate gantries with a rigid, corrosion-resistant frame construction. EPO-113 wafer grinding, lapping, and polishing tool provides a number of user-controllable parameters. This includes the speed of both the feed and the rotation motors, the pressure cycle for application and removal of grinding and polishing media, and the total cycle time. The electromechanical asset also allows for precise and repeatable grinding, lapping and polishing processes as well as precise wafer positioning, ensuring correct mechanical-chemical alignment of the application and removal process. The operational environment of EPO 113 model is designed to facilitate the efficient operation of the equipment. This includes a clean environment with a nitrogen supply, as well as temperature and humidity control. A wide range of accessories are also available, including cooling systems, gas regulators, safety covers, and sample chips, allowing for the full control of the polishing process. The system's advanced control algorithms allow for intuitive programming and operation of the unit. This automated machine can be interfaced with a number of additional systems, including PCs, networks, or controllers. An interactive display, located in the front panel, allows for further user control. EBARA EPO-113 wafer grinding, lapping, and polishing tool is a complete, automated solution for polishing a wide variety of wafers. The precise motion control, electromechanical asset, and advanced control algorithms provide reliable precision polishing results. The user-controllable parameter setting, intuitive programming and interfacing, and wide range of accessories add to the model's well-rounded capabilities.