Used EBARA EPO-113 #9133001 for sale

EBARA EPO-113 is a wafer grinding, lapping and polishing equipment designed for high-precision, high-quality grinding, lapping and polishing of semiconductor wafers. This system utilises the latest advancements in technology and design to provide a low-cost and highly reliable wafer processing solution. EBARA EPO 113 is a mechanical wafer grinding unit, with a grinding wheel diameter of 300mm, and a lap plate diameter of 250mm. The machine operates with two grinding separates, which can be independently operated to perform either grinding and lapping processes. The tool is equipped with an in-line grinding spindle motor that provides superior torque and uniform agitation of the grinding or lapping media. EPO-113 has several features designed to increase grinding efficiency and precision. The most notable of these is the asset's four-axis control and powerful drive model, which provides maximum accuracy with minimal cycle time. The four-axis control permits simultaneous control of X, Y, and Z-axis motion, as well as a rotary motion that allows for the precise alignment of the grinding/lapping wheel with the wafer surface. Other features of EPO 113 include a high-precision laser height adjustment equipment that eliminates need to manually adjust the grinding wheel position, optical alignment of the grinding wheel, and a "laser grooving" tool (available as an optional attachment) ideal for applications that require stringent flatness control. These features combine to create a powerful and dependable system that produces high-precision results in wafer grinding, lapping and polishing operations. EBARA EPO-113 is designed for use in both production and laboratory environments, and its modular design makes it possible to process a wide variety of wafer materials and sizes. The unit is equipped with tooling that meets industry standards for accurate wafer-to-head grinding and a variety of post-polishing patterning. Integrated safety features also ensure that the machine operates safely in any environment, providing users with peace of mind. Overall, EBARA EPO 113 is a state-of-the-art wafer grinding, lapping and polishing tool that offers superior performance and reliability. The asset's advanced features make it well-suited for the processing of a variety of wafer materials and sizes, while its modular and easy-to-operate design ensures that users can achieve top-notch results with minimal effort.