Used EBARA EPO-113 #9210283 for sale

EBARA EPO-113 is a Wafer Grinding, Lapping & Polishing equipment designed to provide high productivity and quality throughout its lifecycle. EBARA EPO 113 features a unique combination of advanced technologies for precision grinding, lapping, and polishing. This system allows operators to perform a variety of complex processes including back-grinding, front-grinding, lapping, and polishing of wafers up to 6 inches in diameter. EPO-113 consists of a main machine body, base and cover, multiple grinding spindles, automated loading/unloading tables, transfer arms, separators, and optional lapping and polishing systems. The main machine body features a robust, closed-looped frame design that is capable of holding multiple wafer grinding and lapping spindles. The spindles are belt driven and feature high speed and uniform rotations to ensure precise and consistent wafer grinding and lapping. The main machine body also includes a mechanical depth of cut control, automated spindle-locking systems, automated drive systems, as well as sensors to ensure accuracy of configurations. The base and cover of EPO 113 are constructed of lightweight aluminum alloy materials. They are designed to easily slide in and out of the main machine body for simple maintenance and testing of the inner components. This lightweight design also facilitates efficient loading and transport of EBARA EPO-113. The loading and unloading of EBARA EPO 113 is facilitated by multiple automated loading and unloading tables featuring diameters of up to 6 inches. The automated transfer arms provide multiple pick-up multiple transfer locations for efficient flow of wafers throughout the entire production line. The separators are programmed to automatically remove wafers from the production line once processing is complete. The optional lapping and polishing unit of EPO-113 uses a unique horizontal and downward sloping design. This design ensures that wafers are gently "walked" down the sloping plating to ensure uniformity of the surface across the entire wafer. This machine is capable of reaching nanometer-level surface finishes. EPO 113 is a robust and versatile wafer grinding, lapping, and polishing tool that is designed to ensure high productivity and quality throughout its lifetime. The unique combination of advanced technologies, automated loading and unloading components, and an optional lapping and polishing asset make EBARA EPO-113 the ideal model for precision grinding, lapping, and polishing of wafers up to 6 inches in diameter.