Used EBARA EPO-113 #9219031 for sale

EBARA EPO-113 is a state of the art multifunctional wafer grinding, lapping and polishing equipment. It is designed for producing a wide range of flat, perfectly finished surfaces on a wafer with different requirements. EBARA EPO 113 combines capability, accuracy and reliability into a single system. EPO-113 features two independent carriers, each of which features four 3-axis numerical controlled grinding spindles and two carriers are built into the unit. The 3-axis spindles can be programmed to produce even and precise results over a wide variety of treatments. The two carriers are capable of independent operating with different functions, allowing the machine to perform multi-level grinding, lapping and polishing with a single pass. This saves time and increases accuracy and productivity. EPO 113 is fitted with slotted surface plate for secure positioning of the wafers, giving the entire unit improved accuracy. The tool is protected against dust contamination with air-purging mechanisms including sealed enclosures and vacuum recovery systems. EBARA EPO-113 features a high-resolution digital display monitor which allows for visual confirmation of process parameters, providing good control and traceability. The asset is modular and can be configured to the customer's specific needs, allowing the model to be taken apart for easy transport and storage. EBARA EPO 113 is equipped with advanced Sicoya control software, which is easy to use and intuitive. It allows users to easily programme and control multiple processes, and results in accurate wafer processing. The software also allows for data logging and traceability of wafer process parameters, which is useful for quality management of wafer processing. Being a wafer-level polisher, EPO-113 offers excellent solutions for wafer machining. Its highly accurate machining results offer enhanced product quality and yield. Its 3-axis equipment's ability to perform multiple processing steps in a single pass substantially reduces cycle time and cost of wafer machining. EPO 113 system is designed to provide high quality flat surfaces that meet exact requirements.