Used EBARA EPO-213 #293814769 for sale

EBARA EPO-213 is a precision wafer grinding, lapping, and polishing equipment capable of producing ultra-fine finishes on a variety of materials. This system is designed specifically for high production rates, ultra-fine final polishes, and a variety of grinding and finishing applications. EPO-213 is equipped with a powerful two-axis numerically controlled grinding spindle and a servo-driven end effector that is designed to achieve ultra-precision lapping and polishing. This enables the unit to achieve superior surface finish in short grinding times. The end-effector also provides a self-compensating machine that quickly adjusts to changes in part geometry from one part to the next. EBARA EPO-213 is also outfitted with the latest in automated wafer handling technology. This includes wafer loaders, a wafer magazine, and an unloader. The loaders and unloaders provide a complete automated wafer transfer process, allowing for a rapid transfer of wafers with minimal labor costs and manual handling. The tool is powered by a heavy-duty 8-inch grinding spindle that is ideal for grinding very hard materials, such as quartz, glass, and chrome-molybdenum. The asset also features a coolant stabilization model which reduces grinding heat and ensures even distribution of coolant during grinding operations. EPO-213 is also equipped with an advanced servo-controlled polishing equipment. This system is capable of achieving high levels of repeatability while polishing a wide variety of materials and surface finishes. Additionally, the unit has an array of advanced features, such as adjustable lapping pressures, adjustable plate rotation speeds, and programmable wafer orientation, that enable it to meet diverse polishing needs. EBARA EPO-213 is completely enclosed in a dust-proof and static-free working environment. This includes a stainless steel front panel with air-conditioning, a double-walled chamber, and a high-pressure air flow machine. The unit also includes a user-friendly touch screen interface that allows for easy operation and control. EPO-213 is an ideal solution for customers requiring a precision wafer grinding, lapping, and polishing tool for high-volume production rates. This asset provides superior surface finishes while saving labor costs and time by utilizing automated wafer handling, and optimizing production rates with its efficient and reliable grinding and polishing operations.