Used EBARA EPO-222 #115588 for sale

EBARA EPO-222 is a wafer grinding, lapping and polishing equipment designed for preparation of ultra-smooth surfaces for semiconductor wafers during wafer fabrication. The system is capable of grinding, lapping and polishing a wide variety of materials such as silicon, gallium arsenide, quartz and aluminum synthetics. The unit consists of two main components - the main unit and the abrasive machine. The main unit is an electrically operated, free-standing tool with an industrial cabinet enclosing the grinding/lapping/polishing components. There is an elevator platform to raise and lower the wafer as well as an adjustable turntable platform for holding the wafer during lapping and polishing steps. Three lapping/polishing tables are mounted to the main unit, each containing the necessary elements for different finishing processes. The abrasive asset is comprised of a separately stored abrasive hopper and delivery model. This equipment has a vacuum to control the delivery of abrasive particles onto the wafer during grinding, lapping and polishing. Abrasive delivery to the wafer is achieved by adjusting the flow rate and pressure of the vacuum pump. The abrasive system also contains an air knife with variable speed fan for brushing the particles from the wafer surface once the required process has been completed. The unit has a variety of safety features to reduce the risk of accident or injury. The main unit has a safety switch which must be activated for any grinding/lapping/polishing process to take place. The machine also contains a dust collector to capture any particles that may become airborne during the finishing process. The machine also has a precision control tool that allows for precise control of the finishing process. The grinding, lapping and polishing parameters can be adjusted to provide optimal processing results. The asset also has various monitoring and diagnostic features that aid in fault finding and reducing down time. EBARA EPO222 model is an ideal solution for the preparation of semiconductor wafers. The equipment's design features high levels of safety and precision control, while providing a reliable and efficient grinding, lapping and polishing process.