Used EBARA EPO-222 #115590 for sale

EBARA EPO-222 is a state-of-the-art wafer grinding, lapping and polishing equipment used in semiconductor manufacturing and other industries requiring precision accuracy. EBARA EPO222 system is specifically designed to offer efficiency and quality, providing top performance in semiconductor grinding, lapping and polishing applications. EPO 222 unit consists of a main body and ancillary equipment, which include lapping fixtures, lapping plates, lapping basins, and a compliance head. The machine runs on a dual voltage drive motor and is able to achieve speeds up to 700rpm. The main body of the tool features heavy-duty construction, cast aluminum frame and stainless steel door for durability and ease of maintenance. It is enclosed in a sealed, dust-proof cabin for optimal safety and performance. The lapping fixtures are used to attach the lapping basins to the main body for easy transfer of the wafers. The lapping plates are used to raise and tilt the lapping basins to the optimal angle, to enable an uniform and thinner grind. The lapping basins feature high-precision alloy knives with multi-layer coating, to enable smooth and efficient lapping operations. The compliance head enables the control over the wafer's processing frequency, ensuring that the grinding and lapping operations are carried out successfully and with a high degree of precision. EBARA EPO 222 is equipped with advanced monitoring and protection systems to ensure optimal performance, safety and longevity. The asset includes an automatic alarm and shutdown feature to prevent any damage due to overloading or overheating. The model is also equipped with an automatic lubrication equipment, which provides lubrication to the lapping fixtures, lapping plates and lapping basins, thus ensuring minimal wear and tear and maximum efficiency of the system. EPO222 unit is designed for reliable performance and low cost of ownership, ensuring an uninterrupted production process and improved yields. With a lightweight design and an integrated manual tracking feature, EPO-222 is simple and easy to operate, making it an ideal wafer grinding and polishing solution for the semiconductor industry.