Used EBARA EPO-222 #293775096 for sale

EBARA EPO-222 is an automated wafer grinding, lapping and polishing system that provides superior results for the most demanding applications when compared to traditional manual grinding and polishing methods. The system consists of a main grinding/polishing table, a main motor and drive unit, two separate upper and lower grinding/lap stages, a static polishing stage, and a polishing film application and removal station. All of these components combined make the system compact, cost effective, and user friendly while providing excellent results. The main grinding/polishing table of EBARA EPO222 is designed to hold up to six wafers at once and has adjustable speed settings, allowing the user to grind and polish multiple wafers at different speeds. The main motor drive has a high torque, allowing for consistent grinding and polishing pressure, enabling even and consistent results every time. The two separate upper and lower grinding/lap stages can handle any shape wafer or substrate surface and can be adjusted with precision for repeatable results. This flexibility allows for grinding angles, distances and pressures to be adjusted precisely to ensure perfect polishing regardless of the complexity of the surface. The static polishing stage of EPO 222 is designed to apply a specific amount of pressure evenly along the entire wafer surface or substrate material, ensuring void free surfaces. The paper application and removal station is used for the removal of any residue from the substrate and works with both flat and curved surfaces. EPO-222 is easy to use and requires minimal effort to set up, making it a great choice for any precision grinding, lapping, and polishing application. The vibratory action of the table simulataneously polishes the entire wafer surface and is gentle enough to handles even the most delicate materials. The ability to polish large quantities of wafers with repeatable results makes EPO222 an excellent choice for any wafer related production processes.