Used EBARA EPO-222 #293775100 for sale

EBARA EPO-222 is a precision surface finishing machine designed for grinding, lapping, and polishing of wafers, as well as components with small dimensions. It is suitable for semiconductor and optoelectronic applications requiring fast, accurate and repeatable results. The grinding head, lapping plate, and polishing plate are highly accurate and designed to provide superior performance in terms of surface finish quality. The variable speed Y-axis and X-axis tables allow the user to easily adjust the position of the grinding head to obtain the desired surface effect. The machine features three separate polishing stations which can be used for different materials. The polishing pads can be precisely positioned with the help of an XY axis adjustable table. The abrasive media is mounted in a unique "U" shaped polishing head in order to ensure consistent polishing performance. EBARA EPO222 is equipped with a fully automated robotic arm which facilitates the loading/unloading of wafers from the processing area, as well as the automatic exchange of abrasive media and polishing pads. The equipment is also designed with a laser alignment system and an automatic filter cleaning feature that helps increase process repeatability and reduce media consumption. The machine is operated via a controller with an intuitive touchscreen interface and easy-to-understand operational menus. The unit also features a data log that allows for the precise monitoring of all process parameters over time, including time and media consumption rate, temperature, RPM, and grinding/polishing results. In conclusion, EPO 222 is an advanced and versatile wafer grinding, lapping, and polishing machine. It offers repeatable, accurate results with high-precision surface finish quality, and is suitable for a variety of precision applications. The intuitive operation interface and automated features make this tool an ideal solution for achieving a high level of surface finish quality with minimal effort.