Used EBARA EPO-222 #293809026 for sale

EBARA EPO-222 wafer grinding, lapping & polishing equipment is a state-of-the-art system designed to accurately grind, lap, and polish wafers up to 200 mm in diameter. It is ideal for applications such as CMP (chemical mechanical polishing) and MEMS (microelectromechanical systems). The unit is equipped with a digital servo motor for precise control over grinding and polishing operations. It has a rotary table for positioning and loading wafers. The table can be easily adjusted to reach the desired position for loading and unloading wafers. The grinding wheel is driven by a three-phase AC motor, which can be regulated in speed and timing. The wheel has a semicircular grinding wheel and two sides to it - one side for grinding and one side for polishing. The wheel is coupled to the drive motor via a flexible coupler. The lapping wheel is driven by a separate three-phase AC motor which is speed-controlled. It consists of a wheel with different grit sizes, depending on the type of material you want to lap. The wheel is synced to the grinding wheel, allowing you to lap both the top and the bottom of the wafers simultaneously. The polishing wheel is driven by another three-phase AC motor and has a large variety of abrasive media available and can perform both wet and dry polishing. The wheel is also coupled to the drive motor via a flexible coupler. The machine is designed to maintain accuracy and repeatability over time by providing a constant velocity of the grinding and polishing wheels. The roughness of the grinding and polishing process can be controlled by adjusting the feed rate of the grind and polish media. The tool is enclosed in a stainless steel housing for corrosion resistance and easy cleaning. The housing has a built-in filtration asset for dust, smoke, and mist for safety. On the inside, a powerful air circulation model removes dust particles from the work zone. EBARA EPO222 is a reliable and efficient equipment for grinding, lapping, and polishing wafers up to 200 mm in diameter. This system allows for consistent and repeatable grinding and polishing processes. With its powerful servo motors, adjustable rotary table and lapping wheel, and multiple abrasive media, this unit provides an ideal solution for CMP and MEMS applications.