Used EBARA EPO-222 #293813196 for sale

EBARA EPO-222 is a wafer grinding, lapping & polishing equipment designed to provide high-precision processing of a variety of semiconductor materials. The system uses a fixed-bed mounting base and linear motor-driven grinding wheel. The grinding wheel is mounted on two adjustable supports which allow angular and height adjustments to be made by manual control. The disc type grinding wheel is used to grind the workpiece to a specific plane and polish it to the desired surface roughness. It is also used for lapping and polishing to achieve a high finish quality. The unit is also equipped with a precision air bearing that can move the grinding wheel so that the plane and the top surface of the wafer can be kept parallel. In addition, EBARA EPO222 is equipped with an on-board CCD camera that allows the operator to observe the surface of the workpiece from the operation panel. It can also be used for alignment, measurement, and other purposes. The machine can be used to process a variety of materials, including silicon, sapphire, quartz, and other semiconductor materials. It also features a user-friendly operating tool that allows for easy operation and maintenance. EPO 222 is a reliable and precise asset that can provide high-precision machining of wafer grinding, lapping & polishing components. It allows for the quick and accurate production of components that meet exact specifications. The model is designed to help improve the quality and productivity of any automated process, providing an efficient and reliable solution for a wide range of industries.