Used EBARA EPO-222 #293814724 for sale

EBARA EPO-222 is a versatile wafer grinding, lapping and polishing equipment designed for cost-efficient processing of semiconductor wafers. It has a versatile two-stage, precision ultra-fine grinding, and two-stage lapping process that is designed to meet exacting standards. This system is capable of lapping wafers up to 200 mm in diameter, with a maximum thickness of 0.04 millimeters. EBARA EPO222 contains a grinding unit with a rotary grinding disc and a urasuki plate, as well as a wafer centering/chuck device. It supports a wide range of abrasives, allowing it to process a range of materials including silicon, sapphire, and quartz. During grinding, the rotary grinding disc rotates and the urasuki plate is oscillated, providing uniform and predictable grinding. A dust collector is integrated in order to control airborne particles. EPO 222 also includes a lapping unit comprising a honing unit and a polishing unit. The honing unit uses a dual-action honing wheel to achieve uniform and controlled removal of the material. It also contains air knife components to control airborne particles. The polishing unit, which is the last step of the lapping process, uses a floating polishing unit to achieve a smooth surface finish. It is capable of excellent lapping performance in a shorter automatic cycle. EBARA EPO 222 has an easy to use touchscreen user interface, allowing recipedriven programming and data logging. It also includes a program protection feature to guard against accidental data loss. This machine is designed for ease of use, with minimal maintenance requirements, and it comes with a range of options and accessories. Overall, EPO-222 is an advanced wafer grinding, lapping, and polishing tool designed for cost-efficient processing of semiconductor wafers. It provides accurate and repeatable operation, with a range of options and accessories to ensure optimal performance. This asset is ideal for semiconductor manufacturers looking for a cost-effective solution for their wafer processing needs.