Used EBARA EPO-222 #293815232 for sale

EBARA EPO-222 is a precision wafer grinding, lapping and polishing equipment, developed by EBARA Precision Machinery, a leading manufacturer of their technology in the industry. Designed for a variety of applications, EBARA EPO222 can support both production and small lot orders. This system can grind, lap and polish any size from two-inch to 200-millimeter wafers. It was designed to be a versatile, cost-effective and compact solution for the semiconductor industry. EPO 222 supports all grinding, lapping and polishing operations with maximum efficiency and precision. It includes multiple learning and teaching features, allowing users to make minor changes quickly and easily. A user interface makes the unit easy to operate for first-time users. EPO222 is designed with powerful, independent grinding, lapping and polishing units. It can process two wafers simultaneously, with first and second grinding operation to ensure a uniform surface. The relative motion between the wafer and the wheel eliminates surface defects caused by residual grinding force. The servomotor-driven spindle head provides precise, smooth oscillation to ensure uniform grinding and polishing. The impact force of each independent grinding, lapping and polishing arm can be adjusted separately to optimize process results. EBARA EPO 222 provides a wide selection of feature options for customizing the machine to specific requirements. This includes a CNC automation unit, process monitoring tool, a particle size analyzer, a diamond slurry management unit, and a asset for surface roughness measurement. Finally, the model is designed for easy maintenance, with easy access to parts and a unique cleaning process. All the parts and components are corrosion and rust-resistant, making it ideal for wet processing, as well as other industrial applications. It is an extremely reliable and cost-effective equipment that is designed to streamline wafer processing.