Used EBARA EPO-222 #293816528 for sale

EBARA EPO-222
ID: 293816528
Wafer Size: 6"
Chemical Mechanical Polishing (CMP) system, 6".
EBARA EPO-222 is a wafer grinding, lapping & polishing equipment that provides a low-cost solution for the final precision processing of semiconductor and other fine components. The system is designed to yield high-precision grinding, lapping, and polishing results on a wide variety of materials, including metals, ceramics, glass, and plastic. EBARA EPO222 adopts a single-disc grinding and polishing process that is capable of producing sub-micron finish on all parts, regardless of size or shape. This unit boasts a wealth of features that enable versatility, high-precision surface finish and various polishing levels. It has a motorized rotary table, precision control and repeatability for uniform passivation and planarization of materials of various thicknesses from 0.1 micron to 3mm. The motorized rotary table offers accurate and repeatable rotation of the wafers, enabling the processing of large numbers of parts in a single operation. The machine uses precise cutting blades for polishing and can process large samples in a single pass, as well as non-standard shapes, and flat and curved surfaces. The variable-speed control ensures consistent results on both finish and parallelism tolerances. A micrometer-adjustable bearing supports the wafers during polishing for repeatable results. The tool also has a fully automated platen replacement asset for efficient platen changes. The spindle-drive safety model and automatic unloading equipment reduce risk of injury and improve efficiency. The system is adaptable to different automation configurations for cost-effective use while maintaining a high degree of precision and reliability. The unit is equipped with a host of sophisticated yet user-friendly features, such as password control, multi-step production saving, up to 5-step grinding sequence control, preset pre-grind, super-precision grinding, and an automatic operation record. These features will not only save time but also increase performance and quality. In addition, the machine is designed to be environmentally friendly. The enclosed grinding chamber ensures that no contaminants are released into the atmosphere during operation. EPO 222 provides an ideal solution for high-precision grinding, lapping, and polishing needs.
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