Used EBARA EPO-222 #293821171 for sale

EBARA EPO-222
ID: 293821171
Wafer Size: 8"
CMP System, 8".
EBARA EPO-222 is a wafer grinding, lapping, and polishing equipment designed for lapping and polishing planar surfaces of a wide range of materials, including dielectric, metal, silicon, and quartz. The system is versatile and user friendly, providing flexibility for different types of polishing processes. The unit is composed of two main components: a polisher with an electromechanical spindle and an integrated grinding and polishing station, and an angled holder for disk-shaped wafers. The polishing station rotates and vibrates the wafer within a ring-shaped area, allowing for grinding and polishing of both hard and soft materials. The spindle can be operated in speeds ranging from 100 to 500 rpm for different hard and soft materials, as well as for different grinding and polishing tasks, allowing for optimum customization as needed. EBARA EPO222 machine is equipped with a robust frame, mounted on casters to facilitate its ease of movement. This makes it ideal for permanent or mobile applications, both small and large. The unit further includes an integrated polishing and grinding filter to protect the equipment from fine particles that can accumulate during the grinding and polishing process that can affect the process. EPO 222's user-friendly interface allows for easy setup of programs for various wafer grinding and polishing needs. Through the interface, users can select different levels of polishing and grinding options, material selection, speed settings, and hold times. In addition, the interface also provides for the convenient import of the user's own programs and data. The tool further allows for complete control of post-polishing activities. This includes the ability to monitor speed, speed change, power consumption, and test results, as well as the scheduling of daily maintenance. Operators can also access a full range of maintenance tools with the click of a button. EPO222 asset is a reliable, cost-effective solution for polishing and grinding operations. With its flexible design and user-friendly interface, it offers operators the ability to craft high-performance parts to exacting standards while ensuring speed, power, and precision.
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