Used EBARA EPO-222 #9083271 for sale

EBARA EPO-222 is an advanced wafer grinding, lapping and polishing equipment designed to meet the growing needs of advanced semiconductor operations. The system employs an advanced grinding algorithm to produce high precision, single crystal surfaces on small diameter wafers at speeds up to 500 wafers per hour. EBARA EPO222 unit is designed for versatility with numerous aggressive grinding and polishing option, providing precise high-speed lapping to ensure the precise high-quality results for wafer surface finish. It is capable of accommodating a wide variety of grinders and polishers on the same framework, enabling efficient process switching and multiple grinders/polishers to be mounted and managed from one machine. The uncomplicated construction of EPO 222 ensures simple installation, operation and maintenance. The machine is equipped with a 15" color touchscreen that is used to control the process parameters and to monitor the progress. The entire process is monitored continuously and any grinding, lapping and polishing parameters that require adjustment can be done easily and quickly, while maintaining the highest results. The grinding/lapping heads of EPO222 are powered by a brushless DC motor, ensuring precise accuracy and constant speed. An advanced spindle bearing tool maintains stiffness and rigidity, while motion control technology ensures accurate concentricity. The asset also contains a high precision scale with a resolution of 0.0001 mm for precise thickness control. EPO-222 is also equipped with advanced technologies such as junction vision, defect detection, and parallelism inspection. The junction vision model automatically measures and monitors junction depth and shape to ensure optimal performance. The defect detection equipment works in real time to detect, localize and classify all anomalies such as pits, particles and distortions on the wafer surface, preventing quality issues and defects from occurring. The parallelism inspection system performs automatic alignment for each wafer, ensuring uniformity between lots. EBARA EPO 222 is a powerful and reliable wafer grinding, lapping and polishing unit that can be used for a variety of production needs. With its advanced features and technologies, the machine can provide precise, high-quality results with a minimum of maintenance and downtime.