Used EBARA EPO-222 #9159058 for sale

EBARA EPO-222 is a state-of-the-art wafer grinding, lapping and polishing equipment. This machine is designed for precise and efficient processing of semiconductor and other material substrates. It is ideal for use in research and development, as well as for production purposes. The system consists of a series of rail-mounted stages, each designed to perform specific tasks in the process. The first stage is grinding. The grinding stage utilizes a ceramic grinding wheel to reduce the substrate material to the desired size and shape. It can achieve a maximum size reduction of up to 0.22μm. The second stage is lapping. This uses a diamond abrasive to further refine the surface of the substrate, providing a high level of accuracy and repeatability. The third and final stage is polishing, which utilizes a series of liquid and slurry polishing processes to refine the substrate's surface to a mirror finish. EBARA EPO222 is also equipped with a variety of sensors and software to automate and optimize the process. The unit is equipped with an autodose unit that dispenses the required amount of chemicals for each process. Additionally, it includes OPC (Optical Process Control) technology, which automates the process and provides feedback on the progress through real-time graphical analysis. The machine's configuration is highly customizable, and it can be adapted to a variety of substrates and tasks. It has a maximum substrate size capacity of 4" (100mm) and utilizes a range of sterilizable grinding, lapping, and polishing tools. It is also compatible with a wide range of abrasives. With all these features, EPO 222 is a powerful and highly accurate tool for producing perfect results, every time.