Used EBARA EPO-222 #9203984 for sale

EBARA EPO-222 Wafer Grinding, Lapping and Polishing equipment is designed to assist in the production of semiconductor wafers with ultra-smooth surfaces. The system incorporates a grinding table, two cylindrical grinding stones, a lubrication unit, two polishing heads, and a filter unit. The grinding table is a large, durable, and precision-machined part, made from cast iron or stainless steel. It provides a flat and even surface against which the wafer is worked and upon which the grinding stones move. The grinding stones are made from special diamond particles which enable the production of ultra-smooth surfaces. The lubrication machine feeds a thin film of oil over the grinding stone and wafer, preventing scoring and damage to both as they shift against each other during the grinding process. The tool can be adjusted to maintain a range of viscosities, thereby allowing for flexibility in the settings in order to optimize performance. The polishing heads have down-force arms which hold the wafer in place on the grinding table while pressurizing the polishing cloth. They move the wafer in an up-and-down motion along the table, over the polishing cloth stroking it against the surface of the wafer which removes small particles and imperfections. The filter unit is designed to catch particles produced by the polishing process and remove them from the asset, thereby ensuring that the particles do not contaminate the wafer surface. The filter also helps in sustained model operations by reducing the volume of particulate contamination, which minimizes the need for frequent equipment maintenance. Overall, the implementation of EBARA EPO222 Wafer Grinding, Lapping and Polishing system provides a cost-effective and reliable means to producing semiconductor wafers with ultra-smooth surfaces which are required to meet the stringent standards of the semiconductor industry.