Used EBARA EPO-222 #9226638 for sale

EBARA EPO-222
ID: 9226638
Wafer Size: 8"
Oxide CMP system, 8".
EBARA EPO-222 is a state-of-the-art wafer grinding, lapping and polishing equipment developed by EBARA Corporation. The system is designed to efficiently grind, lap and polish wafers for semiconductor manufacturing processes. The unit features fully automated diamond and chemical-mechanical polishing modules with precise wafer feed and tracking systems, polishing head adjustment systems, and a wide range of polishing and grinding consumable solutions. The machine can be used to grind, lap, and polish a variety of wafer diameters and shapes. Its innovative wafer feed and tracking systems enable accurate positioning of the wafers on the polishing pads. Additional feedback sensors detect finish parameters such as surface roughness and flatness, allowing for precise control of wafer features and polishing quality. The machine's internal monitoring tool is constantly recording parameters, providing full traceability of the process and ensuring that quality standards are maintained. EBARA EPO222 boasts of high levels of productivity as it can process up to 12 wafers simultaneously at speeds of up to 500rpm. The asset is built using robust materials and components that are designed to deliver excellent mechanical stability, ensuring superior grinding, lapping and polishing results. It is also equipped with a powerful, maintenance-free suction motor and a rugged construction that are designed to minimize vibrations for consistent process repeatability and the highest quality results. In addition, the model also comes with a full suite of consumables and accessories such as polishing agents, grinding films and filter elements. It is also equipped with an advanced user interface, which allows for easy programming and easy access to job recipes. This helps the operator to streamline production setup and improve process quality. By integrating advanced technology, EPO 222 wafer grinding, lapping and polishing equipment provides an efficient way to control process performance and deliver outstanding wafer quality.
There are no reviews yet