Used EBARA EPO-222 #9293808 for sale

EBARA EPO-222 is a fully automated equipment designed for precision wafer grinding, lapping, and polishing of wafers and wafer edges. It is a high-throughput machine with a 270 mm grinding and polishing area that allows for optimal processing of high-volume wafer production in a cost-effective manner. The machine is ideal for processing both 300 mm and 300 mm Wide I/O wafers and is also able to process all common chip types. The system is powered by a 7.5 HP, 2800 rpm main drive motor to deliver optimal grinding, lapping and polishing performance without any sort of vibration or resonance. It also features a two-stage belt drive unit with an adjustable tension machine which helps to minimize any risk of damage caused by overloading. EBARA EPO222 includes a programmable, high-speed spindle with precision linear positioning tool to help precise positioning and precise grinding capabilities. The spindle is driven by a high-speed micro-stepper motor which facilitates smooth and even wafer grinding. This is complemented by an integrated, variable frequency drive (VFD) to regulate the spindle speed in order to accommodate a wide-range of materials. The machine also contains a central lapping asset with an automatic staircase feed model that helps achieve fast and accurate lapping operations. It also contains a two-stage polishing equipment with an oscillating motor to achieve very high surface finish on the wafer edges and surfaces. The lapping and polishing system includes an integrated vacuum unit for dust extraction to ensure clean and reliable operation. EPO 222 comes with a cutting-edge software interface which allows for full customization of systems settings such as grinding speed, power, number of passes, lapping angle, and polishing pressure. It is equipped with a touch-screen monitor and a powerful HMI (Human Machine Interface) control for easy operation and monitoring of the process. Overall, EPO222 is a powerful and cost-effective precision wafer grinding, lapping, and polishing machine which offers excellent performance with minimal waste. It features a powerful 7.5 HP main drive motor, a high-speed spindle, an effective staircase feed tool, and a sophisticated HMI. This makes it an ideal asset for efficient handling of high-volume wafer production with maximum surface quality.